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Electronic News

Posted: Tue Sep 03, 2013 8:27 am
by toom
China into the world, is everyone interested in Chinese language, here are the electronic engineers need to use the words and language both in English and Chinese
附件:attached
样品:sample
承认:approval
答复:answer;reply
规格:spec
与...同样的:the same as
前版本:previous version(old version)
生产:production
确认:confirm
再次确认:double confirm
工程问题:engineering query(EQ)
尽快:ASAP(as soon as possible)
生产文件:production gerber
联系某人:contact somebody
提交样板:submit sample
交货期:delivery date
电测成本:ET(electrical test) cost
通断测试:Open and short testing
参考:refer to
IPC标准:IPC standard
IPC二级:IPC class 2
可接受的:acceptable
允许:permit
制造:manufacture
修改:revision
公差:tolerance
忽略:ignore(omit)
工具孔:tooling hole
安装孔:mounting hole
元件孔:component hole
槽孔:slot
邮票孔:snap off hole
导通孔:via
盲孔: blind via
埋孔:buried via
金属化孔:PTH(plating through hole)
非金属化孔:NPTH( no plating through hole)
孔位:hole location
避免:avoid
原设计:original design
修改:modify
按原设计:leave it as it is
附边:waste tab
铜条:copper strip
拼板强度:panel strong
板厚:board thickness
删除:remove(delete)
削铜:shave the copper
露铜:copper exposure
光标点:fiducial mark
不同:be different from(differ from)
内弧:inside radius
焊环:annular ring
单板尺寸:single size
拼板尺寸:panel size
铣:routing
铣刀:router
V-cut:scoring
哑光:matt
光亮的:glossy
锡珠:solder ball(solder plugs)
阻焊:solder mask(solder resist)
阻焊开窗:solder mask opening
单面开窗:single side mask opening
补油:touch up solder mask
补线:track welds
毛刺:burrs
去毛刺:deburr
镀层厚度:plating thickness
清洁度:cleanliness
离子污染:ionic contamination
阻燃性:flammability retardant
黑化:black oxidation
棕化:brown oxidation
红化:red oxidation
可焊性:solderability
焊料:solder
包装:packaging
角标:corner mark
特性阻抗:characteristic impedance
正像:positive
负片:negative
镜像:mirror
线宽:conductor width
线距:conductor spacing
做样:build sample
按照:as per
成品:finished
做变更:make the change
相类似:similar to
规格:specification
下移:shift down
垂直地:vertically
水平的:horizontally
增大:increase
缩小:decrease
表面处理:Surface Finishing
波峰焊:wave solder
钻孔数据:drilling date
标记:Logo
Ul 标记:Ul Marking
蚀刻标记:etched marking
周期:date code
翘曲:bow and twist
外层:outer layer
内层:internal layer
顶层:top layer
底层:bottom layer
元件面:component side
焊接面:solder side
阻焊层:solder mask layer
丝印层:legend layer (silkscreen layer or over layer)
兰胶层:peelable SM layer
贴片层:paste mask layer
碳油层:carbon layer
外形层:outline layer(profile layer)
白油:white ink
绿油:green ink
喷锡:hot air leveling (HAL)
水金:flash gold
插头镀金:plated gold edge-board contacts
金手指:Gold-finger
防氧化:Entek(OSP)
沉金:Immersion gold (chem. Gold)
沉锡:Immersion Tin(chem.Tin)
沉银:Immersion Silver (chem. silver)
单面板:single sided board
双面板:double sided board
多层板:multilayer board
刚性板:rigid board
挠性板:flexible board
刚挠板:flex-rigid board
铣:CNC (mill , routing)
冲:punching
倒角:beveling
倒斜角:chamfer
倒圆角:fillet
尺寸:dimension
材料:material
介电常数:Dielectric constant
菲林:film
成像:Imaging
板镀:Panel Plating
图镀:Pattern Plating
后清洗:Final Cleaning
叠层:layup (stack-up)
污染焊盘:contaminate pad
分孔图:drill chart
度数:degree
被…覆盖:be covered with
负公差:minus tolerance
标靶盘: target pad
外形公差:routing tolerance
芯板:core
The company ( http://pcb.hqew.net/?s=544864 )is committed to the high precision of single, double side, multi-layer circuit board manufacturing, for the domestic and foreign high-tech enterprises, scientific research units and electronic products to provide high quality products and services.